Published July 1, 2013 | Version v1
Journal article

Effect of rapid thermal annealing on the composition of Au/Ti/Al/Ti ohmic contacts for GaN-based microdevices

  • 1. Instituto de Sistemas Optoelectrónicos y Microtecnología, Universidad Politécnica de Madrid, 28040 Madrid (Spain)
  • 2. Centro de Física Nuclear, Universidade de Lisboa, 1649-003 Lisboa (Portugal)
  • 3. Instituto Tecnológico e Nuclear, Instituto Superior Técnico, Universidade Técnica de Lisboa, 2686-953 Sacavém (Portugal)
  • 4. Departamento de Física Aplicada, Universidad Autónoma de Madrid (Spain)
  • 5. Centro de Micro-Análisis de Materiales, Universidad Autónoma de Madrid (Spain)

Description

The homogeneity of Au/Ti/Al/Ti ohmic contacts for AlGaN/GaN devices was analyzed as a function of the thickness of the Ti barrier (30 nm < d < 90 nm). After rapid thermal annealing, the Al out-diffusion is induced even for the thickest Ti barrier, accompanied by Au in-diffusion and the oxidation of the surface. Uniform contacts were found only for d > 50 nm, although several compositional deficiencies were identified in the distribution maps obtained with the ion microprobe, including the formation of craters. A clear interplay between Ti and Au was found, suggesting the relevance of lateral flows during the rapid thermal annealing

Availability note (English)

Available from http://dx.doi.org/10.1016/j.nimb.2012.12.030

Additional details

Identifiers

DOI
10.1016/j.nimb.2012.12.030;
PII
S0168-583X(12)00791-4;

Publishing Information

Journal Title
Nuclear Instruments and Methods in Physics Research. Section B, Beam Interactions with Materials and Atoms
Journal Volume
306
Journal Page Range
p. 212-217
ISSN
0168-583X
CODEN
NIMBEU

Conference

Title
13. international conference on microprobe technology and applications; 6. workshop on proton beam writing
Acronym
ICNMATA2012
Dates
22-27 Jul 2012
Place
Lisbon (Portugal)

Optional Information

Copyright
Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.