Published March 1989 | Version v1
Journal article

Processing of thick-film dielectrics compatible with thin-film superconductors for analog signal processing devices

  • 1. Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, Cambridge, MA (USA)
  • 2. Lincoln Lab., Massachusetts Institute of Technology, Lexington, MA (USA)

Description

The authors have demonstrated the feasibility of integrating thick-film dielectrics with thin-film superconductors in the fabrication of signal processing devices. Thin films of Nb and NbN are deposited by rf sputtering and patterned photolithographically. Thick film dielectrics can be spun-on to a controlled thickness of 10 to 25 microns, which is an optimum range for high-density, low-loss microwave delay lines. After an organic-binder burnout step at 4500C in air, the ceramic dielectrics are sintered onto the NbN thin films at 8500C in vacuum. The transition temperature of the NbN changes from 15 K as sputtered to 9 K after sintering, but superconductivity is preserved by the presence of thin-film MgO and SiO/sub 2/ barrier layers. Lumped-element resonators, in which the inductor and the capacitor electrodes are made of NbN and the dielectric of thick film ceramic, have been successfully fabricated for measuring the dielectric properties of the ceramics at 4.2 K and 10 MHz. Preliminary results indicate a dielectric constant of 6-8 and tan δ of 10/sup -2/

Additional details

Publishing Information

Journal Title
IEEE Transactions on Magnetics
Journal Volume
25
Journal Issue
2
Series
IEEE Trans. Magn.
Journal Page Range
1255-1257
ISSN
0018-9464
CODEN
IEMGA

Conference

Title
Applied superconductivity conference.
Dates
21-25 Aug 1988.
Place
San Francisco, CA (USA).

Optional Information

Secondary number(s)
CONF-880812--.