Published December 1989
| Version v1
Journal article
Total dose radiation effects for implanted buried oxides
Creators
- 1. Harris Semiconductor Melbourne, FL (USA)
- 2. Integrated Electronics Center, Dept. of Electrical Engineering, Univ. of Florida, Gainesville, FL (USA)
Description
The oxygen implantation process is now the most accepted means of forming an SOI substrate. The authors previously developed a technique based on high frequency C - V measurements, for extracting the fixed charge, interface state, and doping densities at both of the interfaces associated with this buried oxide. Using this technique they show the evolution of these charge densities with irradiation at both oxide interfaces. The densities of trapped holes (Qot) and generated interface states were found to be low. The effect of a substrate bias on the radiation response was characterized, showing that a bias exists that minimizes hole trapping, and that the substrate bias eliminates the differences due to the SIMOX process variations
Additional details
Publishing Information
- Journal Title
- IEEE Transactions on Nuclear Science
- Journal Volume
- 36
- Journal Issue
- 6
- Series
- IEEE Trans. Nucl. Sci.
- Journal Page Range
- 2187-2191
- ISSN
- 0018-9499
- CODEN
- IETNA
Conference
- Title
- 26. annual conference on nuclear and space radiation effects.
- Dates
- 25-29 Jul 1989.
- Place
- Marco Island, FL (USA).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 21052577
- Subject category
- S36: MATERIALS SCIENCE; S74: ATOMIC AND MOLECULAR PHYSICS;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- CRYSTAL DOPING; HOLE MOBILITY; INTERFACES; ION IMPLANTATION; IRRADIATION; OXYGEN; RADIATION HARDENING; SEMICONDUCTOR DEVICES; SILICON OXIDES; SUBSTRATES
- Descriptors DEC
- CHALCOGENIDES; ELEMENTS; HARDENING; MOBILITY; NONMETALS; OXIDES; OXYGEN COMPOUNDS; PHYSICAL RADIATION EFFECTS; RADIATION EFFECTS; SILICON COMPOUNDS
Optional Information
- Secondary number(s)
- CONF-890723--.