T-shape filtered arc deposition system with built-in electrostatic macro-particle trap for DLC film preparation
Creators
- 1. Itoh Optical Industrial Co., Ltd., 3-19 Miyanari, Gamagori, Aichi 443-0041 (Japan)
- 2. Department of Electrical and Electronic Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580 (Japan)
- 3. Onward Ceramic Coating Co., Ltd., Wa-13 Yoshihara, Nomi, Ishikawa 929-0111 (Japan)
- 4. Hitachi Tool Engineering, Ltd., 13-2, Shinizumi, Narita, Chiba 286-0825 (Japan)
- 5. Industrial Research Institute of Ishikawa, 2-1, Kuratsuki, Kanazawa, Ishikawa 929-8203 (Japan)
Description
A T-shape filtered arc deposition system (T-FAD) is a powerful tool to prepare high-quality diamond-like carbon (DLC) films. Most macro-particles (droplets) emitted from the graphite cathode are caught at the extension duct of the droplet catcher or collector facing the cathode, and then the clean plasma bent 90o is transported toward the substrate. However, further droplet reduction is still required in order to realize a higher quality film without droplet incorporation. In the present study, T-FAD employed an electrostatic droplet trap (ES-trap). A cylindrical ES-trap was placed in the extension duct part of the T-shape duct of an electromagnetic plasma transportation and droplet filter. The ion current at the exit of the T-filter duct and the current flowing to the ES-trap were measured as a function of the ES-trap bias voltage for various ES-trap positions. The deposition rate and number of droplets were also measured. As a result, it was found that the optimum voltage of the ES-trap was + 35 V and that it was better to place the ES-trap closer to the plasma beam in order to obtain fewer droplets on the film without an excessive decrease in the deposition rate. In the optimum condition, the number of droplets on the DLC film prepared with ES-trap was reduced to 1/3 of that without the ES-trap.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2009.09.091Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2009.09.091;
- PII
- S0040-6090(09)01553-3;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 518
- Journal Issue
- 5
- Journal Page Range
- p. 1498-1502
- ISSN
- 0040-6090
- CODEN
- THSFAP
Conference
- Title
- 36. international conference on metallurgical coatings and thin films
- Acronym
- 2009 ICMCTF
- Dates
- 27 Apr - 1 May 2009
- Place
- San Diego, CA (United States)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 42058089
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- BEAMS; CATHODES; DEPOSITION; DIAMONDS; DROPLETS; GRAPHITE; PLASMA; SHAPE; THIN FILMS; TRAPS
- Descriptors DEC
- CARBON; ELECTRODES; ELEMENTS; FILMS; MINERALS; NONMETALS; PARTICLES
Optional Information
- Copyright
- Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.