Published December 31, 2009 | Version v1
Journal article

T-shape filtered arc deposition system with built-in electrostatic macro-particle trap for DLC film preparation

  • 1. Itoh Optical Industrial Co., Ltd., 3-19 Miyanari, Gamagori, Aichi 443-0041 (Japan)
  • 2. Department of Electrical and Electronic Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580 (Japan)
  • 3. Onward Ceramic Coating Co., Ltd., Wa-13 Yoshihara, Nomi, Ishikawa 929-0111 (Japan)
  • 4. Hitachi Tool Engineering, Ltd., 13-2, Shinizumi, Narita, Chiba 286-0825 (Japan)
  • 5. Industrial Research Institute of Ishikawa, 2-1, Kuratsuki, Kanazawa, Ishikawa 929-8203 (Japan)

Description

A T-shape filtered arc deposition system (T-FAD) is a powerful tool to prepare high-quality diamond-like carbon (DLC) films. Most macro-particles (droplets) emitted from the graphite cathode are caught at the extension duct of the droplet catcher or collector facing the cathode, and then the clean plasma bent 90o is transported toward the substrate. However, further droplet reduction is still required in order to realize a higher quality film without droplet incorporation. In the present study, T-FAD employed an electrostatic droplet trap (ES-trap). A cylindrical ES-trap was placed in the extension duct part of the T-shape duct of an electromagnetic plasma transportation and droplet filter. The ion current at the exit of the T-filter duct and the current flowing to the ES-trap were measured as a function of the ES-trap bias voltage for various ES-trap positions. The deposition rate and number of droplets were also measured. As a result, it was found that the optimum voltage of the ES-trap was + 35 V and that it was better to place the ES-trap closer to the plasma beam in order to obtain fewer droplets on the film without an excessive decrease in the deposition rate. In the optimum condition, the number of droplets on the DLC film prepared with ES-trap was reduced to 1/3 of that without the ES-trap.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2009.09.091

Additional details

Identifiers

DOI
10.1016/j.tsf.2009.09.091;
PII
S0040-6090(09)01553-3;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
518
Journal Issue
5
Journal Page Range
p. 1498-1502
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
36. international conference on metallurgical coatings and thin films
Acronym
2009 ICMCTF
Dates
27 Apr - 1 May 2009
Place
San Diego, CA (United States)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
42058089
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
BEAMS; CATHODES; DEPOSITION; DIAMONDS; DROPLETS; GRAPHITE; PLASMA; SHAPE; THIN FILMS; TRAPS
Descriptors DEC
CARBON; ELECTRODES; ELEMENTS; FILMS; MINERALS; NONMETALS; PARTICLES

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.