Published December 2015
| Version v1
Journal article
Atomic structure and growth mechanism of T1 precipitate in Al–Cu–Li–Mg–Ag alloy
Creators
- 1. Department of Physics and Astronomy, Seoul National University (SNU), Seoul 151-742 (Korea, Republic of)
- 2. Center for Correlated Electron Systems, Institute for Basic Science (IBS), Seoul 151-742 (Korea, Republic of)
- 3. Department of Materials Science and Engineering and Research Institute of Advanced Materials, Seoul National University, Seoul 151-744 (Korea, Republic of)
- 4. School of Advanced Materials Science and Engineering, SungKyungKwan University, Gyeonggi-do 440-746 (Korea, Republic of)
Description
The atomic structure of a 0.94-nm-thick T1 precipitate in an Al–Cu–Li–Mg–Ag alloy is investigated by combining aberration-corrected scanning transmission electron microscopy (STEM) and energy-dispersive X-ray spectroscopy (EDX). Ag segregates at the first layer of the T1 precipitate interface, revealing a significant compositional variation of Ag throughout the interface. Moreover, the T1 precipitate thickened from 0.94 nm with successive stacking of identical 0.94 nm thick layers
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2015.07.020Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2015.07.020;
- PII
- S1359-6462(15)00311-5;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 109
- Journal Page Range
- p. 68-71
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47041255
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ALUMINIUM ALLOYS; COPPER ALLOYS; INTERFACES; LAYERS; LITHIUM ALLOYS; MAGNESIUM ALLOYS; PRECIPITATION; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; VARIATIONS; X-RAY SPECTROSCOPY
- Descriptors DEC
- ALLOYS; ELECTRON MICROSCOPY; MICROSCOPY; SEPARATION PROCESSES; SPECTROSCOPY; TRANSITION ELEMENT ALLOYS
Optional Information
- Copyright
- Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.