Effect of substrate temperature on the surface and interface oxidation of NiTi thin films

NiTi shape memory alloy thin films are deposited on pure Cu substrate at substrate ambient temperatures of 300 deg. C and 450 deg. C. The surface and interface oxidation of NiTi thin films are characterized by X-ray photoelectron spectroscopy (XPS). After a subsequent annealing treatment the crystallization behavior of the films deposited on substrate at different temperatures is studied by X-ray diffraction (XRD). The effects of substrate temperature on the surface and interface oxidation of NiTi thin films are investigated. In the film surface this is an oxide layer composed of TiO2. The Ni atom has not been detected on surface. In the film/substrate interface there is an oxide layer with a mixture Ti2O3 and NiO in the films deposited at substrate temperatures 300 deg. C and 450 deg. C. In the films deposited at ambient temperature, the interface layer contains Ti suboxides (TiO) and metallic Ni