Published May 1996 | Version v1
Miscellaneous

A study on the stress singularity parameter of metal/epoxy adhering interface

  • 1. Soongsil University, Seoul (Korea, Republic of)

Description

The stress and displacement fields at the close vicinity of a bonding edge show singularity behaviors. Accordingly, the adhesive strength evaluation using maximum stresses is not valid. Therefore it is required to adopt the stress singularity parameter. In this paper, The newly substituting extrapolation method is used to calculate the stress singularity parameter, Ks in simplified metal/epoxy adhesive model. Relationship of Ks and delamination length was also studied.

Part of:
Proceedings of the Korean Society for Nondestructive Testing Spring Meeting 1996

Additional details

Publishing Information

Publisher
KSNT
Imprint Place
Seoul (Korea, Republic of)
Imprint Title
Proceedings of the Korean Society for Nondestructive Testing Spring Meeting 1996
Imprint Pagination
211 p.
Journal Page Range
p. 150-155

Conference

Title
1996 Spring Meeting of the Korean Society for Nondestructive Testing
Dates
20 May 1996
Place
Seoul (Korea, Republic of)

INIS

Country of Publication
Korea, Republic of
Country of Input or Organization
Korea, Republic of
INIS RN
46011517
Subject category
S42: ENGINEERING;
Resource subtype / Literary indicator
Conference, Non-conventional Literature
Descriptors DEI
BONDING; COMPUTER CALCULATIONS; EXTRAPOLATION; INTERFACES; STRESSES; VALIDATION
Descriptors DEC
FABRICATION; JOINING; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION; TESTING

Optional Information

Notes
9 refs, 13 figs, 2 tabs