Strain mapping of silicon carbon suspended membranes
- 1. Department of Physics, University of Warwick, Coventry, CV4 7AL (United Kingdom)
- 2. School of Engineering, University of Warwick, Coventry, CV4 7AL (United Kingdom)
Description
Highlights: • A novel process has been developed to fabricate suspended Si1-yCy membranes. • The process can be extended to silicon membranes as an alternative to SOI wafers. • The strain of the suspended Si1-yCy epilayer was measured using a µ -XRD technique. • The tensile strain of the suspended Si1-yCy increased by 20% of its original value. • Increased tensile strain is caused by crystalline tilt at edges of the membrane. The alloy silicon carbon (Si1-yCy) has various strain engineering applications. It is often implemented as a dopant diffusion barrier and has been identified as a potential buffer layer for cubic silicon carbide (3C-SiC) heteroepitaxy. While suspended membranes formed from thin films of semiconductor (Ge and 3C-SiC) and dielectric (Si3N4) materials have been well studied, pseudomorphic, defect-free epilayers under high levels of tensile strain have received little attention. Often, tensile strain is a desired quality of semiconductors and enhancing this property can lead to various benefits of subsequent device applications. The strain state and crystalline tilt of suspended Si1-yCy epilayers have been investigated through micro-X-ray diffraction techniques. The in-plane tensile strain of the alloy was found to increase from 0.67% to 0.82%. This strain increase could reduce the C content required to achieve suitable levels of strain in such alloys and further strain enhancement could be externally induced. The source of this strain increase was found to stem from slight tilts at the edges of the membranes, however, the bulk of the suspended films remained flat. The novel process utilised to fabricate suspended Si1-yCy thin-films is applicable to many other materials that are typically not resistant to anisotropic Si wet etchants.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.matdes.2021.110135Additional details
Identifiers
- DOI
- 10.1016/j.matdes.2021.110135;
- PII
- S0264127521006900;
Publishing Information
- Journal Title
- Materials and Design
- Journal Volume
- 211
- Journal Page Range
- vp.
- ISSN
- 0264-1275
- CODEN
- MADSD2
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54033328
- Subject category
- S36: MATERIALS SCIENCE; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ALLOYS; ANISOTROPY; BUFFERS; CARBON; DIELECTRIC MATERIALS; DIFFUSION BARRIERS; DOPED MATERIALS; MEMBRANES; SEMICONDUCTOR MATERIALS; SILICON; SILICON CARBIDES; SILICON NITRIDES; THIN FILMS; X-RAY DIFFRACTION
- Descriptors DEC
- CARBIDES; CARBON COMPOUNDS; COHERENT SCATTERING; DIFFRACTION; ELEMENTS; FILMS; MATERIALS; NITRIDES; NITROGEN COMPOUNDS; NONMETALS; PNICTIDES; SCATTERING; SEMIMETALS; SILICON COMPOUNDS
Optional Information
- Copyright
- Copyright (c) 2021 Published by Elsevier Ltd.