Micro-thermal analysis of NiTi shape memory alloy thin films

A novel technique of micro-thermal analysis (micro-TA) has been used to investigate martensitic to austenitic transformations of near equi-atomic NiTi shape memory alloy (SMA) thin films deposited on silicon wafer by a plasma assisted sputter deposition technique. The results demonstrate that both power and sensor deflection signal of the technique, equivalent to micro-differential thermal analysis (μDTA) and micro-thermomechanical analysis (μTMA), respectively, have a capability of locally characterising transformation temperatures of the SMA films. The phase transition temperatures can be identified as an abrupt deviation of power and thermal expansion from linearity. The change in probe deflection reveals a sample contraction of 0.44% following the martensite to austenitic transformation. This dimension change is consistent with the difference in the unit cell volumes of the different phases. The individual films investigated here show a spatial variation on the micron-scale in the martensite to austenite transition temperatures as the surface is probed. A possible reason for this may lie in the inhomogeneous distribution of Ti and Ni in the film structure as the transition temperature is very sensitive to composition, showing typically a 100 K temperature change between 50 and 51 at.% Ni in Ti. Conventional bulk DSC experiments were carried out on the same materials and the results were compared with those from the micro-TA