Published December 23, 1975 | Version v1
Patent Open

Nonswelling alloy

Creators

Description

An aluminum alloy containing one weight percent copper has been found to be resistant to void formation and thus is useful in all nuclear applications which currently use aluminum or other aluminum alloys in reactor positions which are subjected to high neutron doses

Availability note (English)

MF available from INIS under the Report Number.

Files

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Additional details

Additional titles

Augmented title (English)
Patent; resistant to radioinduced void formation

Publishing Information

Imprint Pagination
4 p.
IPC:
Int. Cl.C22C21/12.
IPC
Int. Cl.C22C21/12.
Patent number
US patent document 3,928,027

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
7254986
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ALUMINIUM BASE ALLOYS; BINARY ALLOY SYSTEMS; COPPER ALLOYS; PHYSICAL RADIATION EFFECTS; REACTOR MATERIALS; STABILITY; VOIDS
Descriptors DEC
ALLOY SYSTEMS; ALLOYS; ALUMINIUM ALLOYS; RADIATION EFFECTS; TRANSITION ELEMENT ALLOYS

Optional Information

Notes
PAT-APPL-499,104.