Published 1996 | Version v1
Book

New hard multilayers on the basis of the system To-Al-C-N obtained by PECVD

  • 1. Technische Univ. Dresden (Germany)

Description

The metastable phases (Ti,Al)N and (Ti,Al)C have been deposited using a pulsed DC-discharge and a reproducible multilayer process comprising (Ti,Al)N was realized. The influence of the multilayer formation on layer structure and stress was investigated. By multilayer deposition a decrease of stress and an increase of adhesion can be achieved. Further characterization results are given. (author). 3 refs., 2 figs., 1 Photo

Part of:
Trends and new applications in thin films

Additional details

Publishing Information

Publisher
Societe Francaise du Vide.
Imprint Place
Paris (France)
Imprint Title
Trends and new applications in thin films
Imprint Pagination
298 p.
Journal Page Range
p. 82-84.

Conference

Title
5. International Symposium on Trends and New Applications in Thin Films.
Dates
1-3 Apr 1996.
Place
Colmar (France).

Optional Information