Published May 2016 | Version v1
Journal article

Morphological evolution and migration of void in bi-piezoelectric interface based on nonlocal phase field method

  • 1. School of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering), Shanghai Jiaotong University, Shanghai, 200240 (China)

Description

Highlights: • The evolution of void in bi-piezoelectric interface. • Scale effect has an influence on the evolution of void. • The evolution of left boundary decreases with the growth of scale effect. This paper reports the result of investigation into the morphological evolution and migration of void in bi-piezoelectric material interface by utilizing nonlocal phase field model and finite element method (FEM), where the small scale effect containing the long-range forces among atoms is considered. The nonlocal elastic strain energy and the nonlocal electric energy around the void are firstly calculated by the finite element method. Then based on the finite difference method (FDM), the thermodynamic equilibrium equation containing the surface energy and anisotropic diffusivity is solved to simulate the morphological evolution and migration of elliptical void in bi-piezoelectric films interface. Results show that the way of load condition plays a significant role in the evolution process, and the boundary of void's long axis gradually collapses toward the center of ellipse. In addition, the evolutionary speed of left boundary gradually decreases with scale effect coefficient growth. This work can provide references for the safety evaluation of piezoelectric materials in micro electro mechanical system.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.physe.2015.12.018

Additional details

Identifiers

DOI
10.1016/j.physe.2015.12.018;
PII
S1386947715303271;

Publishing Information

Journal Title
Physica E. Low-Dimensional Systems and Nanostructures (Print)
Journal Volume
79
Journal Page Range
p. 107-112
ISSN
1386-9477

Optional Information

Copyright
Copyright (c) 2015 Elsevier B.V. All rights reserved.