Published October 1, 2014 | Version v1
Journal article

A reconfigurable 256 × 256 image sensor controller that is compatible for depth measurement

  • 1. State Key Laboratory for Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083 (China)

Description

This paper presents an image sensor controller that is compatible for depth measurement, which is based on the continuous-wave modulation time-of-flight technology. The image sensor controller is utilized to generate reconfigurable control signals for a 256 × 256 high speed CMOS image sensor with a conventional image sensing mode and a depth measurement mode. The image sensor controller generates control signals for the pixel array to realize the rolling exposure and the correlated double sampling functions. An refined circuit design technique in the logic level is presented to reduce chip area and power consumption. The chip, with a size of 700 × 3380 μm2, is fabricated in a standard 0.18 μm CMOS image sensor process. The power consumption estimated by the synthesis tool is 65 mW under a 1.8 V supply voltage and a 100 MHz clock frequency. Our test results show that the image sensor controller functions properly. (semiconductor integrated circuits)

Availability note (English)

Available from http://dx.doi.org/10.1088/1674-4926/35/10/105007

Additional details

Publishing Information

Journal Title
Journal of Semiconductors
Journal Volume
35
Journal Issue
10
Journal Page Range
[6 p.]
ISSN
1674-4926

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47018612
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
CONTROL; DESIGN; ELECTRIC POTENTIAL; IMAGES; INTEGRATED CIRCUITS; MHZ RANGE; SEMICONDUCTOR MATERIALS; SENSORS; SIGNALS; SYNTHESIS; TIME-OF-FLIGHT METHOD
Descriptors DEC
ELECTRONIC CIRCUITS; FREQUENCY RANGE; MATERIALS; MICROELECTRONIC CIRCUITS