Microstructure, properties and formation mechanism of SiO2/SiC nano-coating onto carbon fiber by non-electrode plasma electrolysis
- 1. Department of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081 (China)
Description
Recently we have developed a novel non-electrode plasma electrolysis technique in order to rapidly prepare SiO2/SiC nano-coating onto carbon fiber. The surface and cross-sectional microstructures of the SiO2/SiC nano-coating were systematically investigated. The nano-coating was dense and roughly uniform, mainly composed of amorphous SiO2, where a small amount of SiC was distributed. A superior bonding was observed between the nano-coating and the fiber substrate. The cross-sectional TEM revealed ∼80 nm in the thickness for the coating. The SiO2/SiC nano-coating significantly reduced the oxidation rate with the burn-out temperature increasing from 880 °C to 1250 °C. It was proposed that the heat evolution, mechanical effect and plasma chemical reactions had a critical effect on the formation of the nano-coating. We believe that the novel non-electrode plasma electrolysis technique will find a wide range of applications in modifying the interface of carbon fiber reinforced composite materials.
Additional details
Identifiers
- DOI
- 10.1016/j.jallcom.2018.09.221;
- PII
- S0925838818334613;
Publishing Information
- Journal Title
- Journal of Alloys and Compounds
- Journal Volume
- 773
- Journal Page Range
- p. 346-351
- ISSN
- 0925-8388
- CODEN
- JALCEU
INIS
- Country of Publication
- Switzerland
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 55067675
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CARBON FIBERS; COATINGS; COMPOSITE MATERIALS; ELECTROLYSIS; MICROSTRUCTURE; PLASMA; SILICON CARBIDES; SILICON OXIDES
- Descriptors DEC
- CARBIDES; CARBON COMPOUNDS; CHALCOGENIDES; FIBERS; LYSIS; MATERIALS; OXIDES; OXYGEN COMPOUNDS; SILICON COMPOUNDS
Optional Information
- Copyright
- Copyright (c) 2018 Elsevier B.V. All rights reserved.