Effect of thermal treatment on the chemical resistance of polydimethylsiloxane for microfluidic devices
- 1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon 440-746 (Korea, Republic of)
- 2. Korea Electrotechnology Research Institute, 111 Hanggaul-ro, Ansan 426-170 (Korea, Republic of)
Description
We investigated the use of thermally treated polydimethylsiloxane (PDMS) for chemically-resistant microchannels. When the PDMS underwent the thermal treatment at 300 °C, swelling was reduced and the surface of the PDMS microfluidic channel endured well in the extracting media such as dichloromethane. Furthermore, despite the small decrease in size after thermal treatment, both the channel shape and transparency were maintained without showing fluid leakage. The thermally treated PDMS had more hydrophilic properties compared to the untreated PDMS. A single step post-casting process described in this work does not require complex chemical treatments or introduction of foreign materials to the host PDMS substrate, thus expanding the application area of PDMS-based microfluidics. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0960-1317/23/3/035007Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Micromechanics and Microengineering. Structures, Devices and Systems
- Journal Volume
- 23
- Journal Issue
- 3
- Journal Page Range
- [7 p.]
- ISSN
- 0960-1317
- CODEN
- JMMIEZ
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47053935
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- CASTING; CASTINGS; COMPARATIVE EVALUATIONS; FLUID FLOW; FLUIDIC DEVICES; FLUIDS; HEAT TREATMENTS; LEAKS; METHYLENE CHLORIDE; OPACITY; SILOXANES; SUBSTRATES; SURFACES; SWELLING
- Descriptors DEC
- DEFORMATION; EVALUATION; FABRICATION; OPTICAL PROPERTIES; ORGANIC CHLORINE COMPOUNDS; ORGANIC COMPOUNDS; ORGANIC HALOGEN COMPOUNDS; ORGANIC SILICON COMPOUNDS; PHYSICAL PROPERTIES