Published March 1, 2012
| Version v1
Journal article
Large scale, highly dense nanoholes on metal surfaces by underwater laser assisted hydrogen etching near nanocrystalline boundary
- 1. School of Industrial Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47906 (United States)
Description
A new method to generate large scale and highly dense nanoholes is presented in this paper. By the pulsed laser irradiation under water, the hydrogen etching is introduced to form high density nanoholes on the surfaces of AISI 4140 steel and Ti. In order to achieve higher nanohole density, laser shock peening (LSP) followed by recrystallization is used for grain refinement. It is found that the nanohole density does not increase until recrystallization of the substructures after laser shock peening. The mechanism of nanohole generation is studied in detail. This method can be also applied to generate nanoholes on other materials with hydrogen etching effect.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.apsusc.2011.12.065Additional details
Identifiers
- DOI
- 10.1016/j.apsusc.2011.12.065;
- PII
- S0169-4332(11)01967-2;
Publishing Information
- Journal Title
- Applied Surface Science
- Journal Volume
- 258
- Journal Issue
- 10
- Journal Page Range
- p. 4254-4259
- ISSN
- 0169-4332
- CODEN
- ASUSEE
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44030501
- Subject category
- S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- CRYSTALS; DENSITY; ETCHING; GRAIN BOUNDARIES; HYDROGEN; LASER RADIATION; NANOSTRUCTURES; RECRYSTALLIZATION; SHOT PEENING; STEELS; SURFACES; UNDERWATER
- Descriptors DEC
- ALLOYS; CARBON ADDITIONS; COLD WORKING; ELECTROMAGNETIC RADIATION; ELEMENTS; FABRICATION; IRON ALLOYS; IRON BASE ALLOYS; LEVELS; MATERIALS WORKING; MICROSTRUCTURE; NONMETALS; PHYSICAL PROPERTIES; RADIATIONS; SURFACE FINISHING; SURFACE TREATMENTS; TRANSITION ELEMENT ALLOYS
Optional Information
- Copyright
- Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.