Stresses induced in the deposit substrate interface during particles growth

We study stresses induced in the deposit substrate interface during a metal deposit growth. The stresses cause strains in the substrate and the substrate deformation is measured by an optical method. This technique enables the observation of strain variations in situ during the deposit growth. We have investigated the stresses in the case of Au and Cu vapor, deposited under vacuum on Al2O3, and the dependence of these stresses on the deposit mean thickness. The stresses are compressive and they increase during the first stages of growth. They decrease and become tensile when coalescence occurs. (orig.)