Published December 2009 | Version v1
Journal article

Time-dependent creep deformation of the coating-based system under in-plane bending moment

  • 1. Key Laboratory of Safety Science of Pressurized System, Ministry of Education, East China University of Science and Technology, Shanghai 200237 (China)

Description

The aim of this paper was to investigate the creep deformation of coating-based system under in-plane bending moment. An analytical model was proposed to predict the creep strain and stress within the coating-based system through extending the classic beam theory. Once the material properties and thicknesses of the coating and substrate were identified, the implementation of the model was fairly straightforward. A basic understanding of the time-dependent behavior of the coating-based systems was achieved by using this model, which can be used to guide their design and fabrication. Specific results were calculated for the time-dependent curvatures of the NiCrAlY coating/IN718 substrate systems, and the stresses as well as strains in them. The effects of the exposure time, coating thickness, and creep-law parameter of the coating on the stress and curvature of the coating-based systems were discussed.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.matdes.2009.05.005

Additional details

Identifiers

DOI
10.1016/j.matdes.2009.05.005;
PII
S0261-3069(09)00207-6;

Publishing Information

Journal Title
Materials and Design
Journal Volume
30
Journal Issue
10
Journal Page Range
p. 4543-4547
ISSN
0261-3069
CODEN
MADSD2

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
45017493
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
BENDING; CREEP; DESIGN; FABRICATION; STRAINS; STRESSES; SUBSTRATES; THICKNESS; TIME DEPENDENCE
Descriptors DEC
DEFORMATION; DIMENSIONS; MECHANICAL PROPERTIES

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.