Application of forward five point central difference method in the temperature field model of laser processing silicon wafer

This paper develops an analysis of ultimate capacity of hot-rolled RHS and SHS, Traditional laser processing of silicon wafers usually uses phase transition method to remove materials, resulting in melting material resorting to overheated temperature and forming recast layer after cooling, which will affect the processing quality and material properties. This paper is Based on water jet assisted laser machining and the thought of energy balance, and apply prior to the central five point difference scheme to structure two dimensional transient temperature field model around cutting groove during the process of water jet assisted laser machining. At the same time, it will verify the applicability of the numerical model according to comparing the temperature field and the experimental results. (paper)