Development of toroidal plasma (TP) magnetron sputtering method

A new sputtering technique termed the toroidal plasma (TP) magnetron sputtering method is proposed in order to suppress the bombardments of γ-electrons and high energy particles to the substrate during film deposition. A novel point of this apparatus is the form of the toroidal plasma on a magnetic planar ring target. Co-Cr films and Co-Zr ones were prepared by TP magnetron sputtering method. From the erosion profile of the target, the toroidal plasma was confined on Co planar ring target by the magnetic flux. The deposited Co-Cr films showed c-axis orientation and magnetic anisotropy perpendicular to the film plane. On the other hand, the deposited Co-Zr films showed amorphous state and soft magnetic properties. (author)