Experimental Investigation on Thermoresistance between AlN, Bi-2223 and OFHC in High T_c- Direct Cooling Technology

In the development of high temperature superconducting (HTS) direct cooling technology, the high electric insulation high heat conducting AlN has become one of the important components. The thermal contact resistance between AlN, Bi-2223 and OFHC is investigated by experiment with a G-M cryocooler as the source of cooling. The heat conductivity of AlN is measured between 29 and 160 K temperatures. When the temperature on the interface layer side of Bi-2223 is 55 K, under the action of the contact pressure of 0.5469 MPa, the thermal contact resistance between AlN and Bi-2223 is 38.86 times to the thermal conduction resistance of a 10 mm thick AlN pad. Baced on micro-nanocryogenics, it is proposed that the thermal contact resistance is one of the crucial techniques to be attacked in HTS direct cooling technology