Published July 15, 2008 | Version v1
Journal article

Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition

  • 1. Kanagawa Academy of Science and Technology, KSP Building West 614, 3-2-1 Sakado, Takatsu-ku, Kawasaki, Kanagawa 213-0012 (Japan)
  • 2. Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa-machi, Koza-gun, Kanagawa 253-0114 (Japan)

Description

A hydrophobic/super-hydrophilic pattern was prepared on a TiO2 thin film by a new fabrication process. The process consists of five key steps: (1) photocatalytic reduction of Ag+ to Ag (nucleation), (2) electroless Cu deposition, (3) oxidation of Cu to CuO, (4) deposition of a self-assembled monolayer (SAM), and (5) photocatalytic decomposition of selected areas of the SAM. A hydrophobic/super-hydrophilic pattern with 500-μm2 hydrophilic areas was obtained in this process. It is particularly noteworthy that a UV irradiation time of only 1 s was sufficient for the nucleation step in the patterning process

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2008.03.153

Additional details

Identifiers

DOI
10.1016/j.apsusc.2008.03.153;
PII
S0169-4332(08)00637-5;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
254
Journal Issue
18
Journal Page Range
p. 5891-5894
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.