Published August 1994 | Version v1
Journal article

Studies of lattice damage caused by 1 MeV Si+ implantation into Al0.3Ga0.7As superlattices and GaAs at elevated substrate temperature

  • 1. Yantai Teachers' College, Yantai, SD (China)

Description

Rutherford backscattering/channeling technique has been used to investigate the lattice damage caused by 1 MeV Si+ implantation into Al0.3Ga0.7As/GaAs superlattices and GaAs at elevated substrate temperature and room temperature for different doses. For elevated substrate temperature irradiation, a dose range for balance between defect production and dynamic annealing, and a critical dose for unbalance between them are observed for both Al0.3Ga0.7As/GaAs superlattices and GaAs. The superlattices are more difficult to be damaged than GaAs, and the critical dose for the former is also larger than that for the latter. The hot spot and knock-on model is used to interpret the temperature and dose dependence of damage accumulation in the two materials. The relative bond strength in GaAs and AlxGa1-xAs are calculated using CNDO/2 quantum chemistry method to explain the differences of damage accumulation in Al0.3Ga0.7As/ GaAs superlattices and GaAs

Additional details

Publishing Information

Journal Title
Acta Physica Sinica
Journal Volume
43
Journal Issue
8
Journal Page Range
p. 1311-1317.
ISSN
1000-3290
CODEN
WLHPAR