Accumulative roll-bonding: first experience with a twin-roll cast AA8006 alloy
Creators
Description
An ultra-fine grained (UFG) material was prepared from a twin-roll cast (TRC) Al-Fe-Mn-Si (AA8006) sheet using accumulative roll-bonding (ARB) process. After initial failures to achieve good sheet bonding, five cycles of ARB at 200 deg. C were successfully performed. Scanning electron microscopy (Electron Backscatter Diffraction) and transmission electron microscopy (TEM) were used for the characterization of subgrain and grain structures of ARB processed samples. The strength of ARB sheets was evaluated by microhardness measurements. Very fine grain structure (0.4-0.8 μm) with large disorientation was observed after two cycles of ARB. In two samples, areas with extremely fine grains 0.1-0.3 μm in diameter were found. The hardness of the alloy increased from 28 to 60 HV1 after the first two cycles, but during subsequent ARB processing it rose only very slightly
Additional details
Identifiers
- DOI
- 10.1016/j.jallcom.2003.10.082;
- PII
- S0925838804001240;
Publishing Information
- Journal Title
- Journal of Alloys and Compounds
- Journal Volume
- 378
- Journal Issue
- 1-2
- Journal Page Range
- p. 322-325
- ISSN
- 0925-8388
- CODEN
- JALCEU
Conference
- Title
- 9. international symposium on physics of materials
- Acronym
- ISPMA 9
- Dates
- 1-4 Sep 2003
- Place
- Prague (Czech Republic)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 37028726
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ALUMINIUM ALLOYS; DIFFRACTION; FAILURES; IRON ALLOYS; MANGANESE ALLOYS; MICROHARDNESS; SCANNING ELECTRON MICROSCOPY; SHEETS; SILICON ALLOYS; TEMPERATURE RANGE 0400-1000 K; TRANSMISSION ELECTRON MICROSCOPY
- Descriptors DEC
- ALLOYS; COHERENT SCATTERING; ELECTRON MICROSCOPY; HARDNESS; MECHANICAL PROPERTIES; MICROSCOPY; SCATTERING; TEMPERATURE RANGE; TRANSITION ELEMENT ALLOYS
Optional Information
- Copyright
- Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.