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Published January 16, 2020 | Version v1
Report

Micromachined Infrasound Sensors (Final Report)

  • 1. Silicon Audio, Inc., Austin, TX (United States)
  • 2. University of Texas at Austin, TX (United States)

Description

The goals of this STTR were (i) to realize an infrasound sensor node that is low-cost, small, and therefore suitable for array deployment, while still achieving an input-referred noise floor lower than the low-noise model (LNM) across all frequencies of interest to the monitoring community, and (ii) to realize a complete digital-sensor system in which sensors have an on-board analog-to-digital converter (ADC) and integrated microcontroller, enabling two-way communication between sensors and data acquisition systems. This report summarizes the fabrication, testing, and packaging of a piezoresistive-sensed diaphragm designed specifically for infrasonic monitoring. Progress towards a digital sensor is also summarized. The design and realization of several digital subsystems is presented including data intake, digitization, timing, on-board storage, and transmission.

Availability note (English)

Available from https://www.osti.gov/servlets/purl/1591797; https://www.osti.gov/biblio/1591797; DOE Accepted Manuscript full text, or the publishers Best Available Version will be available free of charge after the embargo period

Additional details

Publishing Information

Imprint Pagination
28 p.
Report number
OSTIID--1591797

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
55006512
Subject category
S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; S47: OTHER INSTRUMENTATION;
Resource subtype / Literary indicator
Non-conventional Literature
Descriptors DEI
ANALOG-TO-DIGITAL CONVERTERS; DATA ACQUISITION SYSTEMS; SENSORS
Descriptors DEC
ELECTRONIC EQUIPMENT; EQUIPMENT