Published April 14, 1992 | Version v1
Patent

Preparation of high temperature superconducting coated wires by dipping and post annealing

Description

This patent describes a process for coating a film on a wire substrate, it comprises: melting a superconducting metal oxide mixture in a crucible to form a melt; coating the substrate with a diffusion barrier; dipping the coated wire substrate into the melt; cooling the coated wire substrate at a rate sufficiently slow to avoid thermal shock and hot cracking; and post-annealing the cooled, coated wire substrate to relieve thermal stresses in the coating, whereupon the superconducting metal-oxide mixture forms a perovskite coating upon the wire substrate

Availability note (English)

Patent and Trademark Office, Box 9, Washington, DC 20232 (United States).

Additional details

Publishing Information

Imprint Pagination
vp.
IPC:
Int. Cl. H01B 13/04.
IPC
Int. Cl. H01B 13/04.
Patent number
US patent document 5,104,850/A/