Published 1993 | Version v1
Book

Origin of selectivity in chemical vapor deposition of tungsten using SiH4 or SiH2F2 as a reducing gas of WF6

  • 1. Hitachi, Ltd., Tokyo (Japan). Central Research Lab.

Description

The adsorption of WF6, SiH4, SiH2F2, SiHF3 and SiF4 in selective W-CVD is investigated in situ using Fourier-transform infrared reflection absorption spectroscopy (FTIR-RAS). The selectivity for W growth is found to originate mainly from the dissociation of the reducing gas (SiH4 or SiH2F2), and not from the dissociation of WF6. That is, the reducing gas dissociates on a W surface to form Si-containing adsorbed species, but not on an SiO2 surface. WF6 can easily react with the Si-containing adsorbed species on the W surface to form W and by-product gases SiHF3 and SiF4

Part of:
Proceedings of the twelfth international symposium on chemical vapor deposition

Additional details

Publishing Information

Publisher
Electrochemical Society.
Imprint Place
Pennington, NJ (United States)
ISBN
1-56677-074-2
Imprint Title
Proceedings of the twelfth international symposium on chemical vapor deposition
Imprint Pagination
451 p.
Journal Page Range
p. 250-256.

Conference

Title
183. Electrochemical Society meeting.
Dates
16-21 May 1993.
Place
Honolulu, HI (United States).

Optional Information

Notes
Imprint:The Electrochemical Society, Incorporated, 10 South Main Street, Pennington, NJ 08534-2896 (United States).
Secondary number(s)
CONF-930571--.