Enhanced adhesion buffer layer for deep x-ray lithography using hard x rays

The first step in the fabrication of microstructures using deep x-ray lithography (DXRL) is the irradiation of an x-ray sensitive resist like polymethylmethacrylate (PMMA) by hard x rays. At the Advanced Photon Source, a dedicated beamline allows the proper exposure of very thick (several mm) resists. To fabricate electroformed metal microstructures with heights of several mm, a PMMA sheet is glued onto a metallic plating base. An important requirement is that the PMMA layer must adhere well to the plating base. The adhesion is greatly reduced by the penetration of even a small fraction of hard x rays through the mask absorber into the substrate. In this work we will show a novel technique to improve the adhesion of PMMA onto high-Z substrates for DXRL. Results of the improved adhesion are shown for different exposure/substrate conditions. copyright 1998 American Vacuum Society