Fabrication of planarised conductively patterned diamond for bio-applications

The development of smooth, featureless surfaces for biomedical microelectronics is a challenging feat. Other than the traditional electronic materials like silicon, few microelectronic circuits can be produced with conductive features without compromising the surface topography and/or biocompatibility. Diamond is fast becoming a highly sought after biomaterial for electrical stimulation, however, its inherent surface roughness introduced by the growth process limits its applications in electronic circuitry. In this study, we introduce a fabrication method for developing conductive features in an insulating diamond substrate whilst maintaining a planar topography. Using a combination of microwave plasma enhanced chemical vapour deposition, inductively coupled plasma reactive ion etching, secondary diamond growth and silicon wet-etching, we have produced a patterned substrate in which the surface roughness at the interface between the conducting and insulating diamond is approximately 3 nm. We also show that the patterned smooth topography is capable of neuronal cell adhesion and growth whilst restricting bacterial adhesion. - Highlights: • We have fabricated a planar diamond device with conducting and insulating features. • A precise method is provided using CVD and RIE techniques to develop the substrate. • The step between conducting and insulating features is less than 3 nm. • Planar topography promotes neuronal cell adhesion and restricts bacterial adhesion. • Neuronal cells prefer conductive diamond (N-UNCD) to non-conductive diamond (UNCD)