Published July 2018
| Version v1
Journal article
The constitutive model and threshold stress for characterizing the deformation mechanism of Al0.3CoCrFeNi high entropy alloy
Creators
- 1. School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi'an 710072 (China)
Description
Isothermal compression experiment of Al0.3CoCrFeNi high entropy alloy were performed at high temperatures. The effects of temperature and strain rate on the deformation behavior are investigated. A constitutive model incorporates the effects of strain rate, strain and temperature is developed to describe the flow stress. Experimental analysis show that the stress exponent n is generally greater than five, which decreases rapidly with increasing of temperature at the initial stage and changes slower subsequently. Structure characterization by the transmission electron microscopy demonstrates that dislocation–precipitate interaction exists during high temperature deformation and the precipitate is B2-type NiAl phase.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.msea.2018.05.109Additional details
Identifiers
- DOI
- 10.1016/j.msea.2018.05.109;
- PII
- S0921509318307767;
Publishing Information
- Journal Title
- Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
- Journal Volume
- 730
- Journal Page Range
- p. 137-146
- ISSN
- 0921-5093
- CODEN
- MSAPE3
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 50044308
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ALUMINIUM ALLOYS; COMPRESSION; DISLOCATIONS; FLOW STRESS; PRECIPITATION; STRAIN RATE; STRAINS; TEMPERATURE RANGE 0400-1000 K; TRANSMISSION ELECTRON MICROSCOPY
- Descriptors DEC
- ALLOYS; CRYSTAL DEFECTS; CRYSTAL STRUCTURE; ELECTRON MICROSCOPY; LINE DEFECTS; MICROSCOPY; SEPARATION PROCESSES; STRESSES; TEMPERATURE RANGE
Optional Information
- Copyright
- Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.