Published April 1, 2016 | Version v1
Journal article

Temperature-dependence of Threshold Current Density-Length Product in Metallization Lines: A Revisit

  • 1. Universitas Indonesia, Depok 16424 Indonesia (Indonesia)
  • 2. University of Texas at Arlington, Texas 76019 (United States)

Description

One of the important phenomena in Electromigration (EM) is Blech Effect. The existence of Threshold Current Density-Length Product or EM Threshold has such fundamental and technological consequences in the design, manufacture, and testing of electronics. Temperature-dependence of Blech Product had been thermodynamically established and the real behavior of such interconnect materials have been extensively studied. The present paper reviewed the temperature-dependence of EM threshold in metallization lines of different materials and structure as found in relevant published articles. It is expected that the reader can see a big picture from the compiled data, which might be overlooked when it was examined in pieces. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1742-6596/710/1/012044

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
710
Journal Issue
1
Journal Page Range
[12 p.]
ISSN
1742-6596

Conference

Title
4. international conference on science and engineering in mathematics, chemistry and physics
Acronym
ScieTech 2016
Dates
30-31 Jan 2016
Place
Bali (Indonesia)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
49005768
Subject category
S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CURRENT DENSITY; DESIGN; ELECTROPHORESIS; LENGTH; REVIEWS; TEMPERATURE DEPENDENCE; TESTING; THERMODYNAMICS; THRESHOLD CURRENT
Descriptors DEC
CURRENTS; DIMENSIONS; DOCUMENT TYPES; ELECTRIC CURRENTS