Published August 30, 2009
| Version v1
Journal article
Intermittent and chaotic vibrations in a regenerative cutting process
- 1. Institute of Physics, Technical University of Chemnitz, Reichenhainer Strasse 70, 09126 Chemnitz (Germany)
- 2. Department of Applied Mechanics, Technical University of Lublin, Nadbystrzycka 36, PL-20-618 Lublin (Poland)
- 3. Department of Mathematical Sciences, Indiana University, 402 N. Blackford Street, Indianapolis, IN 46202-3216 (United States)
- 4. Department of Applied Mathematics, Technical University of Lublin, Nadbystrzycka 36, PL-20-618 Lublin (Poland)
Description
We have examined a cutting process with dry friction and contact loss effects. To model the second pass of the tool through the workpiece, we used a harmonic function representing the surface corrugations. The mathematical model consists of a single differential equation of second order. By numerically solving the governing differential equation, we obtained the time series for the cutting depth for different excitation frequencies. The time series are analyzed using the methods of recurrence plots, recurrence quantification analysis and wavelet analysis. The results show an intermittent character of the system dynamics with transition to chaotic motion.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.chaos.2008.08.018Additional details
Identifiers
- DOI
- 10.1016/j.chaos.2008.08.018;
- PII
- S0960-0779(08)00372-X;
Publishing Information
- Journal Title
- Chaos, Solitons and Fractals
- Journal Volume
- 41
- Journal Issue
- 4
- Journal Page Range
- p. 2115-2122
- ISSN
- 0960-0779
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 41020269
- Subject category
- S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
- Descriptors DEI
- CHAOS THEORY; DIFFERENTIAL EQUATIONS; EXCITATION; FRICTION; FUNCTIONS; MATHEMATICAL MODELS
- Descriptors DEC
- ENERGY-LEVEL TRANSITIONS; EQUATIONS; MATHEMATICS
Optional Information
- Copyright
- Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.