Published August 30, 2009 | Version v1
Journal article

Intermittent and chaotic vibrations in a regenerative cutting process

  • 1. Institute of Physics, Technical University of Chemnitz, Reichenhainer Strasse 70, 09126 Chemnitz (Germany)
  • 2. Department of Applied Mechanics, Technical University of Lublin, Nadbystrzycka 36, PL-20-618 Lublin (Poland)
  • 3. Department of Mathematical Sciences, Indiana University, 402 N. Blackford Street, Indianapolis, IN 46202-3216 (United States)
  • 4. Department of Applied Mathematics, Technical University of Lublin, Nadbystrzycka 36, PL-20-618 Lublin (Poland)

Description

We have examined a cutting process with dry friction and contact loss effects. To model the second pass of the tool through the workpiece, we used a harmonic function representing the surface corrugations. The mathematical model consists of a single differential equation of second order. By numerically solving the governing differential equation, we obtained the time series for the cutting depth for different excitation frequencies. The time series are analyzed using the methods of recurrence plots, recurrence quantification analysis and wavelet analysis. The results show an intermittent character of the system dynamics with transition to chaotic motion.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.chaos.2008.08.018

Additional details

Identifiers

DOI
10.1016/j.chaos.2008.08.018;
PII
S0960-0779(08)00372-X;

Publishing Information

Journal Title
Chaos, Solitons and Fractals
Journal Volume
41
Journal Issue
4
Journal Page Range
p. 2115-2122
ISSN
0960-0779

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
41020269
Subject category
S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Descriptors DEI
CHAOS THEORY; DIFFERENTIAL EQUATIONS; EXCITATION; FRICTION; FUNCTIONS; MATHEMATICAL MODELS
Descriptors DEC
ENERGY-LEVEL TRANSITIONS; EQUATIONS; MATHEMATICS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.