Published January 21, 2008
| Version v1
Journal article
Modelling of thermal conductance during microthermal machining with scanning thermal microscope using an inverse methodology
- 1. Department of Mechanical Engineering, Kun Shan University, Tainan 710, Taiwan (China)
- 2. Institute of Mechanical and Electromechanical Engineering, National Formosa University, Yunlin 632, Taiwan (China)
Description
In this study, a general methodology for determining the thermal conductance between the probe tip and the workpiece during microthermal machining using Scanning Thermal Microscopy (SThM) has been proposed. The processing system was considered as an inverse heat conduction problem with an unknown thermal conductance. Temperature dependence for the material properties and thermal conductance in the analysis of heat conduction is taken into account. The conjugate gradient method is used to solve the inverse problem. Furthermore, this methodology can also be applied to estimate the thermal contact conductance in other transient heat conduction problems, like metal casting process, injection molding process, and electronic circuit systems
Availability note (English)
Available from http://dx.doi.org/10.1016/j.physleta.2007.07.047Additional details
Identifiers
- DOI
- 10.1016/j.physleta.2007.07.047;
- PII
- S0375-9601(07)01081-X;
Publishing Information
- Journal Title
- Physics Letters. A
- Journal Volume
- 372
- Journal Issue
- 4
- Journal Page Range
- p. 519-523
- ISSN
- 0375-9601
- CODEN
- PYLAAG
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39092651
- Subject category
- S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
- Descriptors DEI
- CALCULATION METHODS; ELECTRONIC CIRCUITS; INJECTION; MACHINING; METALS; MICROSCOPY; MOLDING; PROBES; PROCESSING; SIMULATION; TEMPERATURE DEPENDENCE; THERMAL CONDUCTION
- Descriptors DEC
- ELEMENTS; ENERGY TRANSFER; FABRICATION; HEAT TRANSFER; INTAKE
Optional Information
- Copyright
- Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.