Thick microporous silicon isolation layers for integrated RF inductors

In this paper, we present processes to etch high thickness porous silicon layers for RF device applications. Indeed, on-chip inductors realized on bulk silicon suffer from mediocre Q-factor values mainly because of electrical losses into the substrate and capacitive coupling with the silicon appearing beyond 1 GHz. We present a detailed study of etching parameters such as the current density or the HF concentration in HF: H2O:acetic acid based electrolytes. In addition, we propose a prospective study of integrated copper inductor performances on porous silicon substrates in the range of 100 MHz to 10 GHz. (copyright 2008 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)