Published February 1990 | Version v1
Journal article

Thermal diffusivity/conductivity of alumina-silicon carbide composites

  • 1. United Technologies Research Center, East Hartford, CT (USA)
  • 2. Oak Ridge National Lab., TN (USA)

Description

Thermal diffusivity and conductivity values for several Al2O3-SiC whisker composites were determined. The thermal diffusivity values spanned the range from 373 to 1473 K, and thermal conductivity data were obtained between 305 and 365 K. The thermal diffusivity decreased with increasing temperature and increased with SiC-whisker content. An estimate of the thermal conductivity of the whiskers was obtained from the direct thermal conductivity measurements, but attempts to derive whisker conductivity values from the thermal diffusivity data were not successful because the laser flash method lacks the required accuracy and precision. Specimens were subjected to two different thermal quench experiments to investigate the effect of thermal history on diffusivity. In the most severe case, multiple 1073- to 373-K quenches, radial cracks were observed in the test specimens; however, there was no change in diffusivity. The lack of sensitivity to thermal cycling appears to be related to the sample size

Additional details

Publishing Information

Journal Title
Journal of the American Ceramic Society
Journal Volume
73
Journal Issue
2
Series
J. Am. Ceram. Soc.
Journal Page Range
461-464
ISSN
0002-7820
CODEN
JACTA