Characterization of preferred orientation of silver film on copper substrates by x-ray diffraction

Silver films were deposited on copper plates in a typical niacin plating system. X-ray diffraction techniques were used to investigate the preferred orientation of the silver film on copper plates. With the increase of the current density, the growth direction of the preferred silver grains 〈111〉 is extended to a larger coning angle, which will increase the integrated diffraction intensity {311}. The averaged silver grains are bi-pyramids rather than cylinders. (paper)