Dynamic optimization of the transmission efficiency between the solid state microwave sources and the microwave applicator

Microwaves are a fast way to dry moist goods through volumetric heating. During the drying process, materials change their electrical properties. As a result, the impedances at the feed port of the applicator will change and the microwave source is not matched anymore. The amount of reflected power increases and the process efficiency reduces. New semiconductor high power sources can perform a dynamic impedance matching. A lab scaled functional model with two sources was designed and realized. For measuring the scattering parameters during the process run, an embedded two-port vector network analyzer was added. Measurement results confirm the feasibility of the concept. (Author)