Published September 15, 2009
| Version v1
Journal article
Surface and bulk modification of W-La2O3 armor mock-up
- 1. Istituto di Fisica del Plasma, University of Milano-Bicocca, 20125 Milan (Italy)
- 2. Dipartimento di Fisica, Politecnico di Milano, P.zza Leonardo da Vinci, 32-20133 Milan (Italy)
- 3. Department of Materials Science and Laboratory FIB/SEM 'Bombay', University of Milano-Bicocca, Via Cozzi 53, 20125 Milan (Italy)
Description
W-(1%)La2O3 has been investigated after thermal exposure in the Quasi-Stationary Plasma Accelerator facility in order to obtain information regarding its surface damage and morphological modification. The profilometry measurements and the Scanning Electron Microscopy analysis showed that surface erosion and corrugation become more pronounced with increasing the thermal load. The La2O3 particle density inside the sample has been measured by Scanning Auger Microscopy. It decreases with increasing the thermal load and presents a negative gradient from the bulk to the surface.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.jnucmat.2009.06.031Additional details
Identifiers
- DOI
- 10.1016/j.jnucmat.2009.06.031;
- PII
- S0022-3115(09)00692-8;
Publishing Information
- Journal Title
- Journal of Nuclear Materials
- Journal Volume
- 393
- Journal Issue
- 3
- Journal Page Range
- p. 522-526
- ISSN
- 0022-3115
- CODEN
- JNUMAM
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 41082717
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ARMOR; DAMAGE; EROSION; LANTHANUM OXIDES; MODIFICATIONS; PLASMA GUNS; SCANNING ELECTRON MICROSCOPY; SURFACES; TUNGSTEN ADDITIONS
- Descriptors DEC
- ALLOYS; CHALCOGENIDES; ELECTRON MICROSCOPY; LANTHANUM COMPOUNDS; MICROSCOPY; OXIDES; OXYGEN COMPOUNDS; RARE EARTH COMPOUNDS; TRANSITION ELEMENT ALLOYS; TUNGSTEN ALLOYS
Optional Information
- Copyright
- Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.