Effect of sputtering pressure on stacking fault density and perpendicular magnetic anisotropy of CoPt alloys

We report the effects of Ar sputtering pressure on perpendicular magnetic anisotropy in disordered CoPt alloys via the modulation of stacking fault density. The coercivity and anisotropy field of CoPt alloys are gradually enlarged with an increase in Ar sputtering pressure from 3 mTorr to 30 mTorr. Structural analyses using transmission electron microscopy, atomic force microscopy and x-ray reflectivity show that the structural properties of the samples, such as roughness or grain size, are not significantly changed by variations in Ar sputtering pressure. On the other hand, in-plane x-ray diffraction measurements reveal that the stacking fault density is reduced in films grown under higher pressure, and instead favors HCP stacking. Our results suggest that perpendicular magnetic anisotropy in CoPt alloys can be enhanced by the growth of the sample under a high Ar sputtering pressure, which decreases stacking fault density. (paper)