Published May 1983
| Version v1
Journal article
Thermal expansivity measurements below 300 K on a copper--beryllium alloy
Creators
- 1. Ames Laboratory-USDOE* and Department of Physics, Iowa State University, Ames, Iowa 50011
Description
High accuracy (0.1%) linear thermal expansivity results are given for a copper-1.8 wt. % beryllium alloy in both the half-hard and precipitation-hardened conditions. These results, which are of technical importance for low temperature experiments, also show a small anomaly near 25 K in the temperature dependence of the ratio of the alloy expansivity to that of copper
Additional details
Publishing Information
- Journal Title
- J. Appl. Phys.
- Journal Volume
- 54
- Journal Issue
- 5
- Series
- J. Appl. Phys.
- Journal Page Range
- 2844-2846
- ISSN
- 0021-8979
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 14782831
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Numerical Data
- Descriptors DEI
- ACCURACY; BERYLLIUM ALLOYS; COPPER ALLOYS; EXPERIMENTAL DATA; HARDNESS; LOW TEMPERATURE; PRECIPITATION HARDENING; QUANTITY RATIO; THERMAL EXPANSION; VERY LOW TEMPERATURE
- Descriptors DEC
- ALLOYS; DATA; EXPANSION; HARDENING; INFORMATION; MECHANICAL PROPERTIES; NUMERICAL DATA; TRANSITION ELEMENT ALLOYS