Published October 2007
| Version v1
Journal article
The origin of high-mismatch orientation relationships for ultra-thin oxide overgrowths
- 1. Max Planck Institute for Metals Research, Heisenbergstrasse 3, D-70569 Stuttgart (Germany)
Description
A crystallographic orientation relationship (COR) of unusually high lattice mismatch (>15%) between an Al{1 0 0} substrate and its ultra-thin (<1 nm) oxide overgrowth is reported. This striking observation is in contrast with the general assumption that a COR with the lowest mismatch is preferred. However, as shown by thermodynamic model calculations, despite the relatively large energy contributions from residual strain and misfit dislocations, the high-mismatch overgrowth can be stabilized by a relatively low surface energy and a relatively high density of metal-oxygen bonds across the interface
Availability note (English)
Available from http://dx.doi.org/10.1016/j.actamat.2007.07.011Additional details
Identifiers
- DOI
- 10.1016/j.actamat.2007.07.011;
- PII
- S1359-6454(07)00478-8;
Publishing Information
- Journal Title
- Acta Materialia
- Journal Volume
- 55
- Journal Issue
- 17
- Journal Page Range
- p. 6027-6037
- ISSN
- 1359-6454
- CODEN
- ACMAFD
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39047793
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- CRYSTALLOGRAPHY; DISLOCATIONS; INTERFACES; ORIENTATION; OXIDATION; OXIDES; OXYGEN; RESOLUTION; SURFACE ENERGY; THERMODYNAMIC MODEL; THERMODYNAMICS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY
- Descriptors DEC
- CHALCOGENIDES; CHEMICAL REACTIONS; CRYSTAL DEFECTS; CRYSTAL STRUCTURE; ELECTRON MICROSCOPY; ELEMENTS; ENERGY; FILMS; FREE ENERGY; LINE DEFECTS; MATHEMATICAL MODELS; MICROSCOPY; NONMETALS; OXYGEN COMPOUNDS; PARTICLE MODELS; PHYSICAL PROPERTIES; STATISTICAL MODELS; SURFACE PROPERTIES; THERMODYNAMIC PROPERTIES
Optional Information
- Copyright
- Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.