Published February 2013 | Version v1
Journal article

Regularities in the formation of dislocation networks on the boundary of bonded Si(001) wafers

  • 1. St.-Petersburg State University (Russian Federation)

Description

The dislocation networks in structures with hydrophilically bonded Si (001) wafers are investigated by transmission electron microscopy. Networks with differing geometry and type of dominant dislocations are observed. One type of networks, which is typical of bonded structures, is formed on the basis of a square network of screw dislocations and contains a system of unidirectional 60° zigzag-shaped dislocations. It is established that such dislocation networks are flat in structures with an azimuthal misorientation of wafers exceeding 2°, whereas they are three-dimensional at smaller misorientation angles. A unique network of another type is formed only by 60° dislocations, the majority of which are extended along one direction, which does not coincide with the 〈110〉 directions in the boundary plane and has a number of specific features, the explanation of which is impossible within the framework of conventional representations.

Additional details

Identifiers

Publishing Information

Journal Title
Semiconductors
Journal Volume
47
Journal Issue
2
Journal Page Range
p. 264-268
ISSN
1063-7826
CODEN
SMICES

Conference

Title
9. international conference 'Silicon-2012'; 8. school for young scientists
Acronym
Silicon 2012
Dates
9-13 Jul 2012
Place
St. Petersburg (Russian Federation)

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
44063379
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
SCREW DISLOCATIONS; THREE-DIMENSIONAL CALCULATIONS; TRANSMISSION ELECTRON MICROSCOPY
Descriptors DEC
CRYSTAL DEFECTS; CRYSTAL STRUCTURE; DISLOCATIONS; ELECTRON MICROSCOPY; LINE DEFECTS; MICROSCOPY

Optional Information

Copyright
Copyright (c) 2013 Pleiades Publishing, Ltd.