Baseplates in metallic matrix composites for power and microwave applications

Baseplates for microelectronic devices in fields where transform environments are encountered, such as automotive or airborne must have some fundamental characteristics such as: high thermal conductivity, low density, good mechanical properties and a coefficient of thermal expansion (CTE) nearly equal to the microelectronic substrates and the components installed on the baseplates. Metallic matrix composites are very good candidates because they perfectly answer to those requirements. In this presentation, with some examples of electronic devices in power and microwave applications we will show the big interest to use this kind of material. (author)