Published December 4, 2013
| Version v1
Journal article
Micro Thermal Diode with Glass Thermal Insulation Structure Embedded in Vapor Chamber
Creators
- 1. Department of Bioengineering and Robotics, Tohoku University, Sendai (Japan)
- 2. Micro System Integration Center, Tohoku University, Sendai (Japan)
- 3. Advanced Institute for Material Research, Tohoku University, Sendai (Japan)
Description
This paper reports a novel micro thermal diode with an embedded micro glass thermal insulation structure. The diodicity is given by wettability-driven one-way fluid circulation mechanism without any external force. The water circulation only occurs in ''forward'' mode, resulting in low thermal resistance. The glass thermal insulation structure enhances thermal insulation in ''reverse'' mode. The thermal insulation in forward and reverse mode, Rf and Rr, were measured as 2.06±0.34 K/W and 3.04±0.38 K/W, respectively. Therefore, the performance index, Rr/Rf, was 1.47±0.14
Availability note (English)
Available from http://dx.doi.org/10.1088/1742-6596/476/1/012019Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Physics. Conference Series (Online)
- Journal Volume
- 476
- Journal Issue
- 1
- Journal Page Range
- [5 p.]
- ISSN
- 1742-6596
Conference
- Title
- 13. international conference on micro and nanotechnology for power generation and energy conversion applications
- Acronym
- PowerMEMS 2013
- Dates
- 3-6 Dec 2013
- Place
- London (United Kingdom)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 46063667
- Subject category
- S42: ENGINEERING;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- COEFFICIENT OF PERFORMANCE; GLASS; THERMAL INSULATION; VAPORS; WATER; WETTABILITY
- Descriptors DEC
- FLUIDS; GASES; HYDROGEN COMPOUNDS; OXYGEN COMPOUNDS