Published December 4, 2013 | Version v1
Journal article

Micro Thermal Diode with Glass Thermal Insulation Structure Embedded in Vapor Chamber

  • 1. Department of Bioengineering and Robotics, Tohoku University, Sendai (Japan)
  • 2. Micro System Integration Center, Tohoku University, Sendai (Japan)
  • 3. Advanced Institute for Material Research, Tohoku University, Sendai (Japan)

Description

This paper reports a novel micro thermal diode with an embedded micro glass thermal insulation structure. The diodicity is given by wettability-driven one-way fluid circulation mechanism without any external force. The water circulation only occurs in ''forward'' mode, resulting in low thermal resistance. The glass thermal insulation structure enhances thermal insulation in ''reverse'' mode. The thermal insulation in forward and reverse mode, Rf and Rr, were measured as 2.06±0.34 K/W and 3.04±0.38 K/W, respectively. Therefore, the performance index, Rr/Rf, was 1.47±0.14

Availability note (English)

Available from http://dx.doi.org/10.1088/1742-6596/476/1/012019

Additional details

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
476
Journal Issue
1
Journal Page Range
[5 p.]
ISSN
1742-6596

Conference

Title
13. international conference on micro and nanotechnology for power generation and energy conversion applications
Acronym
PowerMEMS 2013
Dates
3-6 Dec 2013
Place
London (United Kingdom)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
46063667
Subject category
S42: ENGINEERING;
Resource subtype / Literary indicator
Conference
Descriptors DEI
COEFFICIENT OF PERFORMANCE; GLASS; THERMAL INSULATION; VAPORS; WATER; WETTABILITY
Descriptors DEC
FLUIDS; GASES; HYDROGEN COMPOUNDS; OXYGEN COMPOUNDS