Published July 1, 2012 | Version v1
Journal article

Active roles of helium in the growth of hydrogenated microcrystalline silicon germanium thin films

  • 1. Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 235 Chengbei Rd. Jiading, Shanghai 201807 (China)
  • 2. Institute of Photo-electronics Thin Film Devices and Technique, Nankai University, 94 Weijin Rd. Nankai, Tianjin 300071 (China)

Description

A combination of hydrogen and helium dilutions was introduced when the microcrystalline silicon germanium (μc-SiGe:H) thin films were prepared by very high frequency plasma enhanced chemical vapor deposition on a low-temperature substrate. An optimum helium flow rate was found to achieve the structural uniformity in the growth direction, while Ge content was found to nearly keep constant with varying flow rates of helium. An abundance of atomic H was detected in plasma due to the attendance of helium and no obvious photosensitivity deterioration was observed on the thin film with a high crystalline volume fraction. The active roles of helium were identified by analyzing the mechanism in the plasma, where both metastable Hem⁎ and He+ can accelerate the diffusion of Ge related radicals and passivation of the dangling bonds on the growth surface, respectively. These phenomena have been revealed by experimental results. Therefore, a combination of hydrogen and helium dilutions can improve the structure of the μc-SiGe:H thin films with little degradation of photo-electronic properties. - Highlights: ► Helium is beneficial for the deposition of microcrystalline silicon germanium. ► An abundance of atomic H was detected in plasma. ► The structural uniformity was improved in the growth direction. ► No obvious photosensitivity deterioration on high crystallized films was observed.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2012.05.017

Additional details

Identifiers

DOI
10.1016/j.tsf.2012.05.017;
PII
S0040-6090(12)00591-3;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
520
Journal Issue
18
Journal Page Range
p. 5940-5945
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2012 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.