Published May 2009 | Version v1
Journal article

Effect of annealing for CuInS2 thin films prepared from Cu-rich ternary compound

  • 1. Department of Electrical and Computer Engineering, Miyakonojo National College of Technology, Yoshio, Miyakonojo, Miyazaki (Japan)
  • 2. Department of Electrical and Electronics Engineering, Tsuyama National College of Technology, Numa, Tsuyama, Okayama (Japan)
  • 3. Department of Applied Science for Electronics and Materials, Kyushu University, Kasuga, Fukuoka (Japan)
  • 4. Department of Electrical and Electronics Engineering, Miyazaki University, Gakuen Kibanadai-nishi, Miyazaki (Japan)

Description

Evaporated CuInS2 films using a single-source were annealed in H2S atmosphere from 250 to 500 C for 60 min. after the evaporation. Polycrystalline CuInS2 powder grown by a hot-press method was employed as a source material. Cu/In ratios of the source were 1.0, 1.2 and 1.5. All the films annealed above 350 C were of CuInS2 single phase regardless of the Cu/In ratio of the source material. The films prepared from the source material of the Cu/In ratio of 1.5 became Cu-rich films, which had the Cu/In ratio of 1.37. Carrier concentrations, resistivities and mobilities of the films annealed above 350 C prepared from the source material of the Cu/In ratio of 1.5 were approximately 1 x 1021 cm-3, 0.1 Ωcm and 0.1 cm2/Vs, respectively, at room temperature. The activation energy of the film annealed at 400 C was evaluated to be 6.5 meV. (copyright 2009 WILEY-VCH Verlag GmbH and Co. KGaA, Weinheim) (orig.)

Availability note (English)

Available from: http://dx.doi.org/10.1002/pssc.200881211

Additional details

Identifiers

Publishing Information

Journal Title
Physica Status Solidi. C, Current Topics in Solid State Physics (Print)
Journal Volume
6
Journal Issue
5
Journal Page Range
p. 1030-1033
ISSN
1862-6351

Conference

Title
16. International conference on ternary multinary compounds
Acronym
ICTMC16
Dates
15-19 Sep 2008
Place
Berlin (Germany)

Optional Information

Notes
With 0 figs., 0 tabs., 10 refs.; SICI: 1862-6351(200905)6:5<1030::AID-PSSC200881211>3.0.TX;2-T