Published 1986
| Version v1
Book
Electrical characteristics of silicon p/sup +/n diodes fabricated by B/sup +/ implantation and rapid thermal annealing in the temperature range 700 - 10000C
Creators
- 1. Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya, Aichi 466 (Japan)
Description
B/sup +/ implanted p/sup +/n diodes were fabricated by rapid thermal annealing (RTA) in the temperature range 700 - 11000C. Values of series resistance of diodes decreased with the annealing temperatures. Leakage current (Ir) was independent of the RTA temperatures. Residual defect concentrations increased in the range 700 - 9000C and decreased in the range 1000 - 11000C. Concentrations of defects with the energy levels of E/sub c-/ 0.33 and E/sub c/ - 0.48 eV were -- 10/sup 12/ cm/sup -3/ for diodes fabricated at 11000C. The growth of defects in the range 700 - 9000C was ascribed to the diffusion of defects from the implanted layer during annealing
Additional details
Publishing Information
- Publisher
- Materials Research Society.
- Imprint Place
- Pittsburgh, PA (USA)
- ISBN
- 0-931837-37-5
- Imprint Title
- Materials issues in silicon integrated circuit processing
- Journal Page Range
- p. 211-216.
Conference
- Title
- Materials Research Society spring meeting.
- Dates
- 15-18 Apr 1986.
- Place
- Palo Alto, CA (USA).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 20002226
- Subject category
- S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ANNEALING; BORON IONS; CRYSTAL DEFECTS; DIFFUSION; ELECTRICAL PROPERTIES; ENERGY LEVELS; FABRICATION; FEASIBILITY STUDIES; HIGH TEMPERATURE; ION IMPLANTATION; SILICON DIODES
- Descriptors DEC
- ATOMIC IONS; CHARGED PARTICLES; CRYSTAL STRUCTURE; HEAT TREATMENTS; IONS; PHYSICAL PROPERTIES; SEMICONDUCTOR DEVICES; SEMICONDUCTOR DIODES