Published May 1, 2020 | Version v1
Journal article

Broadband vibration damping of non-periodic plates by piezoelectric coupling to their electrical analogues

  • 1. Laboratoire de Mécanique des Structures et des Systèmes Couplés (LMSSC), Conservatoire national des arts et métiers (Cnam), 292 rue Saint-Martin, F-75003 Paris (France)

Description

Several solutions for multimodal vibration damping of thin mechanical structures based on piezoelectric coupling have been developed over the years. Among them, piezoelectric network damping consists in using piezoelectric transducers to couple a structure to an electrical network, where the transferred electrical energy can be dissipated. In particular, the effectiveness of coupling rods, beams and plates to their analogous electrical networks has been proven. This work is the first step going towards more complex structures. After defining and experimentally validating a fully passive electrical analogous network of a simply-supported plate, the study is extended to the damping of a non-periodic plate. The non-periodicities here studied include the addition of a local mass and a variable thickness. Numerical simulations and experiments show that in these cases, a broadband damping is achieved once the piezoelectric transducers are coupled to an adequate analogous network. A finite element model of the structure coupled to a 2D non-periodic electrical network is concurrently developed and validated, which is another contribution of the present work. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/1361-665X/ab7948

Additional details

Identifiers

Publishing Information

Journal Title
Smart Materials and Structures (Print)
Journal Volume
29
Journal Issue
5
Journal Page Range
[16 p.]
ISSN
0964-1726

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
53043061
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
COMPUTERIZED SIMULATION; DAMPING; FINITE ELEMENT METHOD; MECHANICAL STRUCTURES; PIEZOELECTRICITY; PLATES; THICKNESS; TRANSDUCERS
Descriptors DEC
CALCULATION METHODS; DIMENSIONS; ELECTRICITY; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION; SIMULATION