Trends in Plasma Processing for Ultra Large Scale Integration Technology

A review of plasma processes involved in silicon device fabrication is presented in this paper. An example of plasma-assisted deposition processes for oxynitride thin film elaboration is presented in the first part of the paper. In the second part of the paper, silicon and dielectric etch processes are discussed and emphasis is put on the key issues which need to be solved in the near future. In the last part of the paper, the applications of plasma processes for advanced lithography techniques will also be discussed. (author)