Bump-bonding joining technologies for the research and development of new detectors

Published 2015 | Version v1

Journal article Metadata-only

no abstract available

Additional details

Original title (German): Bumpbonding-Verbindungstechnologien fuer die Forschung und Entwicklung neuer Detektoren

Journal Title: Verhandlungen der Deutschen Physikalischen Gesellschaft
Journal Issue: Wuppertal 2015 issue
Series: Also available as printed version: Verhandlungen der Deutschen Physikalischen Gesellschaft v. 50(2)
Journal Page Range: [1 p.]
ISSN: 0420-0195
CODEN: VDPEAZ

Title: 2015 DPG Spring meeting of the divisions physics education, extraterrestrial physics, radiation and medicine physics, particle physics and working group accelerator physics
Original Conference Title: DPG-Fruehjahrstagung 2015 der Fachverbaende Didaktik der Physik, Extraterrestrische Physik, Strahlen- und Medizinphysik, Teilchenphysik und dem Arbeitskreis Beschleunigerphysik
Dates: 9-13 Mar 2015
Place: Wuppertal (Germany)

Country of Publication: Germany
Country of Input or Organization: Germany
INIS RN: 47024645
Subject category: S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
Resource subtype / Literary indicator: Conference, No Abstract
Descriptors DEI: BINARY ALLOY SYSTEMS; BONDING; GOLD; INTEGRATED CIRCUITS; LEAD ALLOYS; POSITION SENSITIVE DETECTORS; POWDERS; TIN ALLOYS
Descriptors DEC: ALLOY SYSTEMS; ALLOYS; ELECTRONIC CIRCUITS; ELEMENTS; FABRICATION; JOINING; MEASURING INSTRUMENTS; METALS; MICROELECTRONIC CIRCUITS; RADIATION DETECTORS; TRANSITION ELEMENTS